| 发明名称 |
Semiconductor die and wire bonder holding curved substrate flat and level at processing station, includes plate with resting surface and suction units |
| 摘要 |
<p>The hold-down unit includes a plate (1) with resting surface (2) for the substrate (3). Cavities (7) in the plate, open into the resting surface and include resilient suction units (8.1-8.4). These are raised above the resting surface to contact and pull down the substrate. They are lowered into the cavity during substrate transport.</p> |
| 申请公布号 |
CH695405(A5) |
申请公布日期 |
2006.04.28 |
| 申请号 |
CH20000002222 |
申请日期 |
2000.11.15 |
| 申请人 |
ESEC TRADING SA |
发明人 |
BEHLER STEFAN;SCHUBIGER RETO;ZUMBUEHL BEAT |
| 分类号 |
H01L21/00;H01L21/52;B25B11/00;H01L21/60;H01L21/607;H01L21/68;H01L21/683;H05K13/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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