| 摘要 |
<p>The semiconductor chip (1) is mounted on flexible substrate (2) using a device which has dispensing station (3) for applying adhesive (4) to predetermined substrate sites (5) of substrate, bonding station (6) for bonding semiconductor chips with substrate sites and curing station (7) for hardening the adhesive. During curing, the substrate is fixed onto an even support surface by vacuum. An independent claim is also included for apparatus for mounting semiconductor chip onto flexible substrate.</p> |
