发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 <p>Disclosed is an optical wiring board which enables to deal with a larger amount of information to be processed and a higher speed of information processing. Specifically disclosed is an optical wiring board integrally comprising a rigid section wherein a conductor circuit and an insulating layer are formed on both sides of a substrate and one or more bendable flex sections. Such an optical wiring board is characterized in that the rigid section is provided with an external connection terminal for mounting an optical device and/or a package substrate mounted with an optical device, and at least one of the flex sections is provided with an optical wiring.</p>
申请公布号 WO2006043416(A1) 申请公布日期 2006.04.27
申请号 WO2005JP18367 申请日期 2005.10.04
申请人 IBIDEN CO., LTD.;ASAI, MOTOO;KODAMA, HIROAKI;YAMADA, KAZUHITO 发明人 ASAI, MOTOO;KODAMA, HIROAKI;YAMADA, KAZUHITO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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