| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can control the position deviation of a plurality of semiconductor devices and can be assembled precisely and easily, and to provide a method for assembling the semiconductor device. SOLUTION: The semiconductor device comprises a base substrate 1; a first fixed resin layer 8 on the base substrate 1; a first semiconductor chip 14 on the first fixed resin layer 8; a first substrate 10 at the upper portion of the first semiconductor chip 14; a plurality of first connection balls 5c, 5m, 6c, 6m, 7c, 7m that are separated from the first semiconductor chip 14 and electrically connect the first substrate 10 and the base substrate 1; and a first substrate-sealing resin layer 9 around the first connection balls 5c, 5m, 6c, 6m, 7c, 7m. COPYRIGHT: (C)2006,JPO&NCIPI |
