| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed board and a solder resist printing device that print solder resist on a contactless basis to stabilize quality and improve production efficiency, and to provide a semiconductor device. SOLUTION: In a solder resist printing stage (S4), a wiring pattern and a tape base material provided with a reference mark are fed to a printing mechanism in a loading stage (S41). In a positioning stage (S42), a printing head is positioned for the tape base material by recognizing the reference mark on the stage of the printing mechanism. Then discharge of a resist agent from the printing head of the printing mechanism is controlled on a piezojet basis to print a solder resist pattern on the tape base material including a specified area of the wiring pattern. In the stage of printing the solder resist pattern, information on a product using the tape base material, e.g. print data converted according to a tape drawing in designing are acquired. The printing head is controlled according to the print data. The temperature of the resist agent under the discharge control is adjusted to stabilize the viscosity. COPYRIGHT: (C)2006,JPO&NCIPI
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