发明名称 |
Molded high density electronic packaging structure for high performance applications |
摘要 |
A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.
|
申请公布号 |
US2006087033(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
US20050543301 |
申请日期 |
2005.07.26 |
申请人 |
GOH KIM Y;KAPOOR RAHUL;SUN ANTHONY Y;CHONG DESMOND Y R;HOANG LAN H |
发明人 |
GOH KIM Y.;KAPOOR RAHUL;SUN ANTHONY Y.;CHONG DESMOND Y.R.;HOANG LAN H. |
分类号 |
H01L23/48;H01L23/04;H01L23/31;H01L23/36;H01L23/433 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|