| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic part assembly which can reduce the projection height of a wire without causing a rise of manufacturing cost without using a special capillary or without complicating a packaging process, and therefore without increasing the rise of the manufacturing cost; and to provide a method of manufacturing the electronic part assembly. <P>SOLUTION: The electronic part assembly includes at least one electronic part which has a plurality of part electrodes on one surface, and a substrate in which at least one electronic part is carried so that the above-mentioned one surface may be directed in the same direction as the front surface of the substrate. The plurality of the part electrodes of at least one electronic part are respectively bonded to a plurality of wiring electrodes provided at the substrate side by a plurality of wires. The respective wires are bonded to the respective wiring electrodes by providing a ball part, and bonded to the respective part electrodes without ball part. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
