发明名称 CUTOFF PIECE RECOVERY APPARATUS BY LASER BEAM MACHINING
摘要 PROBLEM TO BE SOLVED: To provide a cutoff piece recovery apparatus by laser beam machining, which recovers a cutoff piece produced when a flexible machining subject is machined by a laser beam, and which needs no new recovery apparatus, and enables economically an improvement in a recovery efficiency of punched pieces such as paper. SOLUTION: A recovery body 24 is partitioned into an air pass area 26 and a recovery area 29 (30) by a filter part 25, the recovery area being divided into a first recovery area 29 and a second recovery area 30 or integrated by a first movable partitioning part 28 which is a first partitioning means. When the cutoff piece is introduced, the first movable partitioning part 28 partitions the recovery area, and when the recovery to the second recovery area 30 is carried out, the first movable partitioning part 28 forms an integral recovery area. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006110444(A) 申请公布日期 2006.04.27
申请号 JP20040299638 申请日期 2004.10.14
申请人 TOPPAN FORMS CO LTD 发明人 HIROHATA WATARU
分类号 B08B5/00;B01D46/42 主分类号 B08B5/00
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