| 摘要 |
An IC card according to the present invention reduces or prevents a deterioration or damage on an electronic device to which the IC card is mounted. A buffer section made of a thermoplastic resin formed by a plastic injection molding is provided at the outer peripheral face of a memory card whose appearance is partly composed of a sealing section made of a thermosetting resin formed by a transfer molding without providing a cap. The buffer section has a taper formed at the outer peripheral corner, and further, the buffer section is softer than the sealing section and has a smooth surface. When the memory card is mounted to an electronic device, the buffer section is brought into contact with connector pins or a guide rail of a connector of the electronic device, thereby being capable of reducing or preventing the deterioration or damage on the connector.
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