| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring substrate which has high junction strength, is easy to design and is provided with a wiring pattern which hardly generates peeling in a pad and wiring and restrains electrical disconnection, and to provide an information processing device whereon the substrate is mounted. <P>SOLUTION: The printed wiring substrate with a BGA package mounted thereon has high junction strength to peeling due to external force, by providing an extension line 4 with a pad 3 and a through hole 2 linearly in almost the same line width as a pad diameter. Since the pad 3 is provided with an angle of almost 45°to the outside of the through hole 2, it is possible to make it follow the direction wherein thermal stress functions, thus being provided with high durability to peeling or the like due to outer force (warp). <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
