发明名称 MOUNTING STRUCTURE OF SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a simple mounting structure of a substrate that is superior in waterproofness. <P>SOLUTION: In the mounting structure of the substrate, the substrate 11 is fixed to the inner surface 10a of a case 10 made by die casting via an adhesive 12, a connector 30 is mounted to the case 10, and a land of the substrate 11 is electrically connected to a terminal 32 of the connector 30 via a bonding wire 34. The connector 30 is constituted of a connector housing 31, inside which a plurality of terminals 32 are embedded, the connector housing 31 is fastened and fixed to the outer surface 10b of the metal case 10 interposed with a packing material 36 with a fastening means 35, the base ends 32b of the plurality of terminals 32 of the connector housing 31 are arranged near the land of the substrate 11, and the land of the substrate 11 is electrically connected to the base ends 32b of the plurality of terminals 32 via the bonding wire 34. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006112963(A) 申请公布日期 2006.04.27
申请号 JP20040301816 申请日期 2004.10.15
申请人 JIDOSHA DENKI KOGYO CO LTD 发明人 ODA TAKANE;KONNO MAKOTO
分类号 G01F1/684;B60R16/02;H01R13/52 主分类号 G01F1/684
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