| 摘要 |
PROBLEM TO BE SOLVED: To improve efficiency in cooling treatment of a substrate while suppressing increase in device costs. SOLUTION: The device performs cooling treatment for the substrate B immediately after it has been subjected to baking treatment, and comprises a cooling plate 30 disposed opposing one surface of the substrate B at the midpoint of a substrate conveying route 14 for conveying the substrates B continuously, and a lifting mechanism 60 as a separating/contacting mechanism part for changing positions between a lower position L1 where the cooling plate 30 and the substrate B are separated from each other and an upper position L2 where the cooling plate 30 and the substrate B are contacted each other. COPYRIGHT: (C)2006,JPO&NCIPI
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