| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate epoxy resin fine particles for conductive fine particles having excellent heat resistance and excellent adhesiveness to metal layers. SOLUTION: The epoxy resin fine particles (C) are characterized by comprising an epoxy resin (A) and an inorganic layered compound (B) which is preferably a clay-organic cation-intercalated compound. The inorganic layered compound (B) is preferably dispersed in the epoxy resin (A) in a delaminated state. The epoxy resin fine particles (C) preferably contain the inorganic layered compound (B) in an amount of 1 to 25 wt.%, and preferably have a number-average particle diameter of 0.1 to 60μm. COPYRIGHT: (C)2006,JPO&NCIPI
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