发明名称 FINE PATTERNING METHOD OF POLYIMIDE RESIN
摘要 PROBLEM TO BE SOLVED: To provide an excellent method of stamping molding to form a fine pattern irrespective of the glass transition point of a polyimide resin. SOLUTION: The method of fine patterning a polyimide resin comprises the steps of coating a substrate surface with a polyamic acid solution, partially drying the solution, thermocompression-bonding a molding material heated at 100°C or higher on the substrate in a depressurized vessel, and peeling off the molding material to form a fine pattern. Preferably, the viscosity of the polyamic acid solution is not smaller than 50 Pa s and not larger than 3,000 Pa s at 23°C and the solid concentration is 5-40 wt%. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006110956(A) 申请公布日期 2006.04.27
申请号 JP20040303379 申请日期 2004.10.18
申请人 KANEKA CORP 发明人 FUJIWARA HIROSHI
分类号 B29C39/02;B29K79/00;H01L21/027 主分类号 B29C39/02
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