发明名称 |
Method for fabricating semiconductor package with short-prevented lead frame |
摘要 |
A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.
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申请公布号 |
US2006088956(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
US20050296592 |
申请日期 |
2005.12.06 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
HUNG JUI-HSIANG;HSU CHIN-TENG;YANG CHEN-HSIUNG;YANG CHIH-JEN |
分类号 |
H01L21/50;H01L23/31;H01L23/495 |
主分类号 |
H01L21/50 |
代理机构 |
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