发明名称 Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
摘要 A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
申请公布号 US2006086118(A1) 申请公布日期 2006.04.27
申请号 US20040970378 申请日期 2004.10.22
申请人 RESEARCH TRIANGLE INSITUTE 发明人 VENKATASUBRAMANIAN RAMA;ALLEY RANDALL G.;ADDEPALLI PRATIMA;REDDY ANIL J.;SIIVOLA EDWARD P.;O'QUINN BROOKS C.;COONLEY KIP D.;POSTHILL JOHN;COLPITTS THOMAS
分类号 F25B21/02;F25D23/12 主分类号 F25B21/02
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