发明名称 |
Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
摘要 |
A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
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申请公布号 |
US2006086118(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
US20040970378 |
申请日期 |
2004.10.22 |
申请人 |
RESEARCH TRIANGLE INSITUTE |
发明人 |
VENKATASUBRAMANIAN RAMA;ALLEY RANDALL G.;ADDEPALLI PRATIMA;REDDY ANIL J.;SIIVOLA EDWARD P.;O'QUINN BROOKS C.;COONLEY KIP D.;POSTHILL JOHN;COLPITTS THOMAS |
分类号 |
F25B21/02;F25D23/12 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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