| 摘要 |
An electronic package assembly is formed with a plurality of integrated circuit dies stacked in layers. At least one first die is placed on a substrate. Each subsequent layer of the stack contains at least one die. Each die on each layer has a size and shape such that, when placed on the dies on a lower layer, it is offset from the edges of the dies on the lower layer to allow affixing of wirebonds to input/output pads of the dies on the lower layer. Each die on each layer with more than one die has input/output pads placed on two sides of the die. Each die on an upper layer is placed orthogonally to each die of a lower each layer such that wirebonds are affixed without interference.
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