METHOD AND SYSTEM FOR WAFER TEMPERATURE CONTROL

摘要

Systems and methods for controlling the temperature of a wafer are disclosed. These systems and methods may employ a back side wafer pressure control system (BSWPC) that includes subsystems and a controller operable in tandem to control the temperature of wafers in one or more process chambers. The subsystems may include mechanical components for controlling a flow of gas to the backside of a wafer while the controller may be utilized to control these mechanical components in order to control wafer temperature in a process chamber. Furthermore, embodiments of these systems and methods may also use a chiller in combination with the controller to provide both coarse and fine temperature control.