发明名称 FILM SUBSTRATE AND PRESSURE-SENSITIVE ADHESIVE TAPE
摘要 PROBLEM TO BE SOLVED: To solve problems of flexibility, hand cutting properties and abrasion resistance in a pressure-sensitive adhesive tape using a film made of a nonhalogen resin composition as a raw material when employed as a tape for binding complicated electric wire cables in an automotive engine room, etc. SOLUTION: A film substrate comprises 100 pts. mass of an aromatic vinylic elastomer, 10-60 pts. mass of a styrenic resin and 1-50 pts. mass of a maleimide copolymer prepared by polymerizing 15-70 mass% of an aromatic vinyl monomer with 30-85 mass% of an unsaturated dicarboximide derivative. The pressure-sensitive adhesive tape is obtained by using the film substrate. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006111646(A) 申请公布日期 2006.04.27
申请号 JP20040297175 申请日期 2004.10.12
申请人 DENKI KAGAKU KOGYO KK 发明人 HASUMI SUIKI;SAIDA SEIJI;SUZUKI KAZUO
分类号 C08L9/06;C08J7/00;C08K3/00;C08L25/04;C08L35/06;C08L53/02;C09J7/02;C09J201/00 主分类号 C08L9/06
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