| 摘要 |
In a gas diffusion plate, a plurality of through holes for passing a processing gas used in processing a substrate are provided. Each one of the through holes provided in a peripheral region of the gas diffusion plate is formed so that an area of an inlet thereof is larger than an area of an outlet thereof. With use of a substrate processing apparatus including the gas diffusion plate, a processing gas can be supplied uniformly in the gas diffusion plate. Accordingly, substrate processing such as film deposition and film etching can be uniformly performed.
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