| 摘要 |
A conductor pattern 22 is formed on a resin film 23 which is made of a thermoplastic resin. Each single-sided conductor pattern film 21 has via-holes 24 filled with an electrically conductive paste 50. A printed conductor pattern 32 and a printed resistor 33 are formed on a ceramic substrate 31. The single-sided conductor pattern films 21 are laminated on the ceramic substrate 31. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board 100. During the heat and press treatment, respective single-sided conductor pattern films 21 and the ceramic substrate 31 bond together while the interlayer connection is obtained between the conductor patterns 22 as well as between the conductor pattern 22 and the printed conductor pattern 32. <IMAGE> <IMAGE> <IMAGE> |
