| 摘要 |
PROBLEM TO BE SOLVED: To reduce EMI occurring from a printed circuit board in relation with an electronic device and the printed circuit board. SOLUTION: In the structure of the electronic device; the region in a printed wiring board 1 is divided into a plurality of separate regions 3, a grounding pattern 5 is arranged opposite to a power supply pattern 4 on the surface of an insulating layer 2, and the grounding pattern 5 is arranged alternately with the power supply pattern 4 on the separate region adjacent to the insulating layer. Further, the power supply patterns 4 on the separate region are electrically connected with each other by a power supply connecting terminal 6, and the adjoining grounding patterns 5 are electrically connected by a grounding connecting terminal 7 with the insulating layer 2 interposed in-between. Moreover, the electronic device has two sets of second insulating layers 14 all over the surface of the power supply pattern 4 and the grounding pattern, an overall grounding layer 13 on the second insulating layer 14 connected to the grounding pattern 5, an insulating layer 16 formed all over the overall grounding layer 13, an electric wiring pattern 10 formed on the surface of the insulating layer 16, and an electronic element 8 mounted on the electric wiring pattern in an arbitrary separate region. COPYRIGHT: (C)2006,JPO&NCIPI |
