| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive ion etching device capable of facilitating etching in microfabrication on a width of 0.3μm or smaller without causing etch stop by using magnetic neutral loop discharge. SOLUTION: The reactive dry etching device is configured in such a way as to employ an NLD etching device, to introduce an etching assist gas from an upper part of a vacuum chamber, to introduce a main etching gas to a substrate side near a magnetic neutral line, and to exhaust the gases from a lower part of a substrate electrode so as to increase an effective exhaust velocity thereof in a low pressure environment. COPYRIGHT: (C)2006,JPO&NCIPI
|
