| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting structure for an IC package preventing flow to the lateral side for solder, when soldering capable of improving the solderability with the solder infiltrating even into a lead terminal and the bottom of an electrode, and is capable of simplifying even a mold structure, and to provide the mounting structure for a surface-mounted part. SOLUTION: In the mounting structure of the IC package, lead terminals 3 for an IC package 1 are mounted on a substrate 4 by the soldering. In the mounting structure of the IC package, the lead terminals 3 are formed at places slightly floated from the underside of a package body 2; and in mounting structure of the IC package, the soldering sections 3a of the lead terminals 3 are brought to a state of slightly floating from the surface of the substrate 4 under a state, in which the package body 2 is brought into contact with the substrate 4, and the lead terminals 3 are mounted and fixed on the substrate 4 by solder 5. COPYRIGHT: (C)2006,JPO&NCIPI
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