| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor device which will become an electronic apparatus or an electronic component, that can be made thin or thick, and has a high resistance to bending due to its flexibility; and to provide a mounting method of a semiconductor device for realizing the mounting structure. SOLUTION: This is a mounting method of a semiconductor device wherein a semiconductor chip 2 is mounted face down on a flexible substrate 1. This mounting method of a semiconductor device comprises processes of forming a buffer layer 3 made of an insulating resin on the flexible substrate 1; forming an interconnection 4 on the buffer layer 3; arranging a liquid material made by dispersing metal fine particles into a dispersion solution, by a drop discharge method either at a connection 4a of the interconnection 4 or at a terminal 7 of the semiconductor chip 2; joining the connection 4a of the interconnection 4 and the terminal 7 of the semiconductor chip 2 via the liquid material; and sintering the metal fine particles by baking the liquid material to connect the connection 4a of the interconnection 4 and the terminal 7 of the semiconductor chip 2, as well as to establish an electric conductivity path between them. COPYRIGHT: (C)2006,JPO&NCIPI
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