发明名称 |
Image sensor assembly and method for fabricating the same |
摘要 |
An assembly device of an image sensor chip is disclosed. A flexible circuit has a die-attached portion, a plurality of bendable portions, and a plurality of bonding portions where the bendable portions extend from the die-attached portion and are connected to the corresponding bonding portions. A plurality of inner leads are formed on the bonding portions. An image sensor chip with bumps is attached to the die-attached portion. The bendable portions are so bent that the bonding portions are located above the image sensor chip. By thermocompression bonding, the inner leads of the flexible circuit are bonded to the bumps on the image sensor chip. In one embodiment, a transparent cover is adhered to the bonding portions and located above a sensing area of the image sensor chip.
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申请公布号 |
US2006087022(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
US20050254677 |
申请日期 |
2005.10.21 |
申请人 |
CHIPMOS TECHNOLOGIES INC. |
发明人 |
CHAO YEONG-CHING;LIU AN-HONG;LEE YAO-JUNG |
分类号 |
H01L23/48;H01L23/02;H01L23/28;H01L27/146 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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