System and method for singulating a substrate

摘要

A laser cutting system includes a laser generating a laser cutting beam for singulating an electronic device from a substrate. A support block is laser machined to include a channel corresponding to an outline of the electronic device to be singulated. Also laser machined within the channel are slag removal vacuum ports. The slag removal vacuum ports are used to remove slag and hold small cutout during singulation. The support block also includes device vacuum ports for holding the electronic device in position after being singulated.