| 摘要 |
973,417. Printed circuits. SOC. D'ELECTRONIQUE ET D'AUTOMATISME. Feb. 8, 1961, No. 4727/61. Heading H1R. [Also in Division H2] A method of interconnecting a stack of printed circuit boards bearing printed conductors on opposite faces and each board being separated from each other by a thin insulating layer, comprises the steps of providing isolated conductive areas on the faces of the boards opposite those conductors adjacent to each of the thin insulating layers, connecting the conductive areas to the conductors by hole metallization and finally connecting the conductive areas themselves by hole metallization. Printed circuit boards I, II each comprising an insulating base 13 carrying on opposite faces conductors 14, 15, Figs. 5 and 6, are glued together by a thin insulating layer 30, Fig. 8. The exterior surfaces a, d of the boards are provided with isolated conductive terminal areas 16 in register with the conductors 15 on the surfaces c, d of the two boards. After connecting each terminal area 16 with a corresponding conductor 15 by filling holes 17 drilled through the board with metal 18 the terminal areas 16 on surface a are connected to areas 16 on surface d by filling holes 27 drilled through the stack with metal 20. Further through connections between conductors 14 on the outer surfaces a and d are similarly made by hole metallization. A stack of three printed circuit boards may be similarly interconnected, Fig. 9 (not shown), by using an additional isolated terminal area. The method may be applied to the interconnection of the windings of multiple winding armatures for electric motors, Figs. 10 to 21 (not shown). Specifications 898,337, 935,652 and 962,322 are referred to. |
