发明名称 PROCESS FOR PREPARING A NON-CONDUCTIVE SUBSTRATE FOR ELECTROPLATING
摘要 <p>A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.</p>
申请公布号 WO2006043994(A2) 申请公布日期 2006.04.27
申请号 WO2005US20635 申请日期 2005.06.10
申请人 MACDERMID, INCORPORATED 发明人 RETALLICK, RICHARD, C.;LEE, HYUNJUNG
分类号 C25D5/34;C25D3/38 主分类号 C25D5/34
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