| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip chip mounting method and a flip chip mounter which are applicable to flip chip mounting of the next-generation LSIs and have high productivity and high reliability. <P>SOLUTION: A flip chip mounting method comprises steps of supplying a resin 13 containing solder powder and a convective additive 12 onto a wiring board 10 having multiple electrode terminals 11, bringing a semiconductor chip 20 having multiple connection terminals 21 into contact with the surface of the resin 13, then heating the wiring board 10 to a solder powder melting temperature in this condition. The heating is conducted at a temperature higher than the boiling temperature of the convective additive 12 to allow the boiled convective additive 12 to flow throughout the resin 13. During this heating process, melted solder powder is self-assembled between the electrode terminals 11 of the wiring board 10 and the connection terminals 21 of the semiconductor chip 20, thereby electrically connecting the electrode terminals 11 to the connection terminals 21. Finally, the resin 13 is cured to fix the semiconductor chip 20 to the wiring board 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
