| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily confirm a jointing condition with a mounting board when it joins to a mounting board. <P>SOLUTION: A semiconductor device 1 comprises a semiconductor chip 2 which has a functional side 2F in which a functional device 2a is formed, a protective resin layer 12 formed on the functional side 2F, and an external connection terminal 10 for electric connection with the exterior formed in the peripheral part on the functional side 2F. The external connection terminal 10 includes a bottom exposure side 10B exposed from a bottom 12B located in the opposite side to the functional side 2F side of the protective resin layer 12, and a side exposure side 10S exposed from a side 12S of the protective resin layer 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
