| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an etching agent for copper or copper alloy which can form fine wiring keeping the wiring width of an electrolytic plating layer, and its manufacturing method, a replenishing liquid and a method for manufacturing a wiring substrate. <P>SOLUTION: The etching agent for copper or copper alloy is an aqueous solution containing 0.01-20 mass% cupric ion, 0.1-30 mass% organic acid, 0.01-20 mass% halogen ion, 0.001-2 mass% azole and 0.001-2 mass% polyalkylene glycol. The method for manufacturing the copper wiring substrate is as the followings, in which a underlaying conductive layer (2) composed of copper or an copper alloy, is formed on the surface of an insulated material (1), and after forming an electrolytic copper plating layer (3) on the portion for electric circuit thereon, the underlaying electric-conductive layer (2) in the portion, in which the electrolytic copper plating layer is not formed, is removed with the etching agent. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
