发明名称 HEAT-CONDUCTIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a heat-conductive resin composition that is easily thin walled by heating and is excellent in moldability, is high in heat-conductivity, has enough strength, is also excellent in handling ability, and is suitable for a phase change-type heat transfer/heat radiation material for a heat build-up parts. SOLUTION: The heat-conductive resin composition comprises a combination consisting of (a) a 5-95 mass% crystalline higherα-olefin copolymer and (b) a 95-5 mass% heat-conductive filler. The heat transfer/heat radiation material comprises the heat-conductive resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006111848(A) 申请公布日期 2006.04.27
申请号 JP20050097005 申请日期 2005.03.30
申请人 IDEMITSU KOSAN CO LTD 发明人 HIGUCHI HIROYUKI;OTA KATSUHISA;SERA MASANORI
分类号 C08L23/24;C08K3/00;C08L101/12;H01L23/36 主分类号 C08L23/24
代理机构 代理人
主权项
地址