| 摘要 |
A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to one surface side of the wafer; and a wafer dividing means comprising a first suction-holding member and a second suction-holding member, both having a holding surface for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line through the protective tape, and a moving means for moving the first suction-holding member and the second suction-holding member in directions that they separate from each other, wherein the holding surface of the first suction-holding member and the holding surface of the second suction-holding member are inclined such that they descend or ascend toward their side edges that are opposed to each other.
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