| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having improved heat radiation, and to provide a semiconductor device having a cooler. <P>SOLUTION: The semiconductor device 1A includes a silicon chip 34; electrodes 32, 36, 38; a resin section 46; inorganic hard films 48, 54; buffer layers 50, 56; and plated layers 52, 58. Insulating properties between micro channel coolers 11A, 12A made of metal and the electrodes 32, 36 are secured by the inorganic hard films 48, 54. Heat radiation surfaces of the electrodes 32, 36 project from the surface of the resin section 46, and adhesion between the micro channel coolers 11A, 12A and the heat radiation surface cannot be deteriorated by the resin section 46, thus causing an advantage in heat radiation. Fitness when joining the micro channel coolers 11A, 12A to the semiconductor device 1A is improved by the plated layers 52, 58, thus dispensing with the application of grease or the like and improving heat conduction. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
