| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To mount, to a printed circuit board, an IC package such as a BGA or the like of narrower terminal interval while using through-holes of ordinary size. <P>SOLUTION: The printed circuit board comprises a mounted IC package having a plurality of connecting terminals arranged like a lattice. This printed circuit board also includes a plurality of lands for connecting the connecting terminals of the package, through-holes for guiding lead wires up to the opposite side surface of the printed circuit board from the lands through the printed circuit board, and upper lands of through-holes provided in the periphery of the same surface side as the lands among the above through-holes. Moreover, the printed circuit board is characterized in that the through-holes surrounded by a plurality of lands are biased toward the lands of equal potential connected to the upper lands of the through-holes. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
