| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method by which a printed wiring board can be manufactured containing a built-in passive element and an inexpensive resistor element which is reduced in the fluctuation of its resistance value than the conventional method. <P>SOLUTION: The method of manufacturing the printed wiring board containing the built-in passive element includes a step of forming a wiring pattern 51a and device electrodes 51c on a substrate, a step of forming a resist patterns 43a having openings (resistor forming areas) 43b on the device electrodes 51c, and a step of forming resistance layers 61 on the whole surface of the resist patterns 43a including the openings (resistor forming areas) 43b. The method also includes a step of peeling the resist pattern 43a and forming a resistor 61a between the device electrodes 51c of the wiring pattern 51a as the resistor element 60. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
