| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board excellent in partitivity which reduces the generation possibility of cracks, burrs and the like at the time of dividing a substrate into each wiring board region. <P>SOLUTION: The substrate comprises two or more wiring board regions 103 formed and arranged in lengthwise and breadthwise directions in a substrate 101, a square-shaped recess 104 for storing electronic parts which is formed in each of two or more wiring board regions 103, and level difference steps 105 formed so that they may be unevenly distributed in one side of the square-shaped recess 104. Two or more wiring board regions 103 is arranged so that the level difference steps 105 of the adjacent wiring board regions 103 face mutually across the boundary of the fellow wiring board regions 103. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
