| 摘要 |
PROBLEM TO BE SOLVED: To make a BGA easy to mount on and remove from a substrate, and also to improve heat dissipation of the BGA. SOLUTION: A heat dissipation sheet 1 connected to a substrate includes a plurality of recesses 1a, electrode wires 1c embedded in the respective recesses 1a, and a plurality of grooves 1b formed on the front or/and rear face. A plurality of solder balls 2a of the BGA 2 are inserted into the plurality of the recesses 1a of the sheet 1. The sheet 1 is tightly interposed between the BGA 2 and a substrate 3. The plurality of solder balls 2a are electrically connected with a plurality of signal pads 3a of the substrate 3 via the plurality of electrode wires 1c. Soldering is not necessary and mounting and removing of the BGA 2 to and from the substrate 3 become easy. Since the air is pushed out of the groove 1b and the air does not reserve on a contact surface when the heat dissipation sheet 1 comes into tight contact with the BGA 2 and the substrate 3, high heat dissipation can be realized, which is especially preferable for a BGA connection structure for use in space appliances. COPYRIGHT: (C)2006,JPO&NCIPI
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