| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device capable of being kept within a temperature range capable of being used even to a base material having little heat resistance and shortening the time required for a sintering or instantaneously completing the time and using the dispersions of metallic fine particles and/or a metallic element compound, and to provide a manufacturing method for the electronic device. SOLUTION: A metallic element and/or a metallic-element compound layer is formed by irradiating a base body, in which a particle-dispersing mixed liquid in which the fine-particle pulverulent bodies of the metallic element and/or the metallic element compound having a mean particle size of 80 nm to 50μm is added to the ultra-fine particle dispersions of the metallic element and/or the metallic element compound having the mean particle size at a value less than 50 nm is printed or applied on the surface of the base body with laser beams. Consequently, a conductivity, a semi-conductivity, a resistance, a dielectric or circuit characteristics required for other electronic devices are revealed. COPYRIGHT: (C)2006,JPO&NCIPI
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