发明名称 Heatsink
摘要 Provided is a heatsink, including a cooling zone to contact an object to be frozen and having microchannels formed therein to define a plurality of fluid pathways, an inlet through which a working fluid enters, a distributor, interposed between the inlet and the cooling zone, to uniformly distribute the working fluid introduced through the inlet to the microchannels, an outlet through which the working fluid, passing through the cooling zone, exits, and a collector, interposed between the cooling zone and the outlet, to collect the working fluid passing through the microchannels.
申请公布号 US7441591(B2) 申请公布日期 2008.10.28
申请号 US20060520012 申请日期 2006.09.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK HEE-SUNG;KIM SUN-SOO
分类号 F28F7/00;F28F13/08;H05K7/20 主分类号 F28F7/00
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