发明名称 Light emitting diode package
摘要 A light emitting diode package is disclosed. It includes a chip, a slug, a PCB, a lens and a reflector. The chip is mounted on the slug. The slug transmits the heat of the chip out of the light emitting diode package. The PCB connects the chip with circuits or wires. The lens transmits the emitting light of the chip out of the light emitting diode package. The reflector reflects the emitting light of the chip, and combines the slug, the PCB and the lens together.
申请公布号 US7441926(B2) 申请公布日期 2008.10.28
申请号 US20060635046 申请日期 2006.12.07
申请人 EVERLIGHT ELECTRONICS CO., LTD. 发明人 PEI CHIEN-CHANG;CHUANG SHIH-JEN
分类号 F21V29/00;H01L33/48;H01L33/58;H01L33/60;H01L33/64 主分类号 F21V29/00
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