发明名称 |
Imaging module and method for forming the same |
摘要 |
An imaging module is formed by stacking: a first resin board; a second resin board having a first opening; a first electrically-conductive member electrically connecting the first resin board and the second resin board to each other; a printed circuit board having a second opening; a second electrically-conductive member electrically connecting the second resin board and the printed circuit board to each other; an imaging semiconductor chip mounted on the lower surface of the second resin board to cover the first opening and provided with an imaging sensor, an optical member placed on the upper surface of the second resin board to cover the first opening; a first semiconductor control chip provided with a control device for controlling operation of the imaging sensor and mounted on the lower surface of the first resin board.
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申请公布号 |
US7443028(B2) |
申请公布日期 |
2008.10.28 |
申请号 |
US20060369818 |
申请日期 |
2006.03.08 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SATOU MOTOAKI;KAWABATA TAKESHI;SHINAGAWA MASATOSHI;FUKUDA TOSHIYUKI |
分类号 |
H01L23/48;H01L27/14;H04N5/335 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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