| 摘要 |
A chip type solid electrolytic capacitor, in which a PCB includes anode and cathode connection lands formed on upper parts of an insulation board, and anode and cathode terminals formed on lower parts of the insulation board. The anode and cathode terminals are electrically connected to the anode and cathode connection lands, respectively, through vias. An anode connection member is formed on the anode connection land. A capacitor device having an anode lead and a cathode layer is mounted on the PCB with the anode lead weld-connected to the anode connection member and the cathode layer electrically connected to the cathode connection land via a conductive adhesive. An outer resin covers side and upper parts of the PCB including the capacitor device. The anode terminal and the cathode terminal have stepped-down surfaces which are formed along at least parts of peripheral portions thereof, respectively, and covered by the outer resin.
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