发明名称 |
MANUFACTURING METHOD OF CONDUCTIVE ELECTROLESS PLATING POWDER |
摘要 |
A method for manufacturing conductive electroless plating powder is provided to increase resin displacement, and obtain bond reliability between electrodes by forming a projected conductive powder with a uniform projection size and coating a part without a projection smoothly. A method for manufacturing conductive electroless plating powder comprises the steps of: forming a first electroless metal plating layer(2) on a surface of a core(1) using resin powder; and injecting a transfer metal and a reducing agent simultaneously in the resin powder which is formed with the first electroless metal plating layer to form a transfer metal projection(3). The transfer metal projection uses a metal which is different from the metal used for the first electroless metal plating layer. A second electroless metal plating layer(4) is formed on the first electroless metal plating layer. A gold plated layer(5) is formed on the second electroless metal plating layer. |
申请公布号 |
KR20080095033(A) |
申请公布日期 |
2008.10.28 |
申请号 |
KR20070039307 |
申请日期 |
2007.04.23 |
申请人 |
HANWHA CHEMICAL CORPORATION |
发明人 |
SON, WON IL;JIN, JEONG HEE;OH, SEOK HEON |
分类号 |
B22F1/02 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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