发明名称 MANUFACTURING METHOD OF CONDUCTIVE ELECTROLESS PLATING POWDER
摘要 A method for manufacturing conductive electroless plating powder is provided to increase resin displacement, and obtain bond reliability between electrodes by forming a projected conductive powder with a uniform projection size and coating a part without a projection smoothly. A method for manufacturing conductive electroless plating powder comprises the steps of: forming a first electroless metal plating layer(2) on a surface of a core(1) using resin powder; and injecting a transfer metal and a reducing agent simultaneously in the resin powder which is formed with the first electroless metal plating layer to form a transfer metal projection(3). The transfer metal projection uses a metal which is different from the metal used for the first electroless metal plating layer. A second electroless metal plating layer(4) is formed on the first electroless metal plating layer. A gold plated layer(5) is formed on the second electroless metal plating layer.
申请公布号 KR20080095033(A) 申请公布日期 2008.10.28
申请号 KR20070039307 申请日期 2007.04.23
申请人 HANWHA CHEMICAL CORPORATION 发明人 SON, WON IL;JIN, JEONG HEE;OH, SEOK HEON
分类号 B22F1/02 主分类号 B22F1/02
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