发明名称 Cooling apparatus for electronic devices
摘要 In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core structure is at least partially elongated in the direction parallel to the mounting base toward outer extremities of the plurality of fins.
申请公布号 US7443683(B2) 申请公布日期 2008.10.28
申请号 US20040993194 申请日期 2004.11.19
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 SEARBY TOM J.
分类号 H05K7/20 主分类号 H05K7/20
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