发明名称 |
Chemical mechanical polishing pad |
摘要 |
A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the face and a side face for interconnecting these faces and including the pattern of recessed portions which are formed on the non-polishing face and are open to the non-polishing face but not on the side face.
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申请公布号 |
US7442116(B2) |
申请公布日期 |
2008.10.28 |
申请号 |
US20040978472 |
申请日期 |
2004.11.02 |
申请人 |
JSR CORPORATION |
发明人 |
MIYAUCHI HIROYUKI;SHIHO HIROSHI;KAWAHASHI NOBUO |
分类号 |
B24D11/00;H01L21/304;B24B37/04;B24B37/20;B24D13/14;C09K3/14 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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