| 摘要 |
The present invention relates to an impedance transformation circuit (I 10; 11 a ; 11 b ; 12 ) with a first contact pad ( 51 ) and a second contact pad ( 52 ) being spaced-apart and formed on a substrate ( 20 ). The impedance transformation circuit comprises at least first circuit element ( 40 ) providing a contact area ( 41 ) formed on the substrate ( 20 ) which is arranged adjacent and between the first ( 51 ) and the second ( 52 ) contact pad. A first wire element ( 31 ) extends over the substrate ( 20 ) connecting the first contact pad ( 51 ) and a first end portion ( 41 a) of the contact area of the first circuit element ( 40 ), whilst at least a second wire element ( 32 ) extends over the substrate ( 20 ) connecting the second contact pad ( 52 ) and a second end portion ( 41 b) of the contact area of the first circuit element ( 40 ). The contact area of the first circuit element ( 40 ) is shaped such that it is provided a capacitive connection with a predetermined capacitance between the contact area and a fixed reference poteitial. The packing density of the whole circuit can advantageously be increased by having tibe first wire element ( 31 ) and the at least second wire element ( 32 ) the same shape and having them arranged substantially in parallel to each other and further, by having the first contact's pad ( 51 ) and the second contact pad ( 52 ) located at opposite sides of the contact area of the at least first circuit element ( 40 ). Multiple impedance transformation circuits according to the invention can advantageously combined to a multi-coupled wire impedance transformation circuit ( 12 ).
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