| 摘要 |
<p>A molded product consisting of the LCP composition is provided to form more less droplet in a reflow soldering, and to manufacture surface mounting type electronics including the switch, relay, connector, collimator, coil, trans, camera module, antenna and chip antenna switch, particularly a device mounted by using the Pb free solder processed at high temperature. A liquid crystalline polymer composition comprises 100.0 parts by weight of LCP and 0.01-1 parts by weight of an inorganic glass filler with a softening point of 550deg.C or less which is softened at a low temperature. The liquid crystalline polymer composition includes 1-200 parts by weight of additional filler selected from fiber, and thin plate and powdered filler. The inorganic glass filler which is softened at a low temperature includes P2O5 and ZnO as the structural ingredient of the glass.</p> |
