| 摘要 |
The invention relates to a method for producing a semiconductor component with at least one surface made optically reflective, in which a silicon wafer, which has an etchable dielectric layer at least in certain regions on at least one of its surfaces, is provided with a silicon-containing masking layer for shielding it from fluidic media. A layer of aluminium is additionally deposited on the masking layer and a thermal treatment of the semiconductor component is subsequently performed, causing the silicon in the aluminium to break down. The invention also relates to a corresponding semiconductor component made from a silicon wafer with at least one surface made optically reflective. Semiconductor components of this type are used in particular as solar cells. |
